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Immersion Gold Process Four-layer Circuit Board Assembly Welding Red Oil Multilayer Board
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Product description
Four-layer Printed Circuit Board
Minimum aperture: 0.25mm
Minimum line width: 0.173mm
Minimum line spacing: 0.076mm
Finished board thickness: 1.6
Outer layer finished copper thickness: 2/2/2/2
Packing method: vacuum packing + desiccant
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